Material Detail

Wafer Inspection in the Photolithography Process

Wafer Inspection in the Photolithography Process

This is a description for a learning module from Maricopa Advanced Technology Education Center. This PDF describes the module; access may be purchased by visiting the MATEC website. In this module, your learners begin to master the sensitive after develop inspection (ADI) methods that follow photolithography. MATEC describes macro- and micro-inspection techniques and distinguishes qualitative (inspection) from quantitative (metrology) methods. The chief focus is on teaching learners to examine wafers under an optical microscope; a simulated microscope is also provided in a computer-based training (CBT) format. The module covers edge bead inspection and provides extensive practice in flash boundary inspection, including evaluating Nikon crosses, overlay boxes, scanning electronic microscope features, resolution bars, Verniers, and product identification numbers.


  • User Rating
  • Comments
  • Learning Exercises
  • Bookmark Collections
  • Course ePortfolios
  • Accessibility Info

More about this material


Disciplines with similar materials as Wafer Inspection in the Photolithography Process


Log in to participate in the discussions or sign up if you are not already a MERLOT member.